Nothing Stacks Up To EPYC™
AMD EPYC 7003 Series Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation, Computational Fluid Dynamics, and Finite Element Analysis software and solutions. Delivering breakthrough performance per core and performance per watt, the Zen 3 architecture maintains leadership in number of cores – up to 64, amount of L3 cache – 768MB, and 128 PCIe 4.0 lanes, while maintaining socket compatibility with existing 3rd Gen AMD EPYC platforms.
GIGABYTE R272-Z32 (rev. A00/B00) - 6NR272Z32MR-00-AT
Supports GRAID SupremeRAID NVMe/NVMe-oF RAID Card AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology AMD EPYC™ 7003 series processor family Single processor, 7nm technology 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 24 x 2.5" Gen3 NVMe hot-swappable bays 2 x 2.5" SATA/SAS hot-swappable bays on rear side
Oferujemy także sześć miesięcy darmowego housingu w naszym centrum danych TIER III.
Komponenty to nie koniec — zapytaj nas o niestandardową konfigurację serwera. Zaplanujemy serwer, złożymy go, fachowo skonfigurujemy i udostępnimy gwarancję rozszerzoną lub NBD.
Kod towaru | 202.166181 |
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Part number | 6NR272Z32MR-00-AT |
Producent | GIGABYTE |
Dostępność | Na zamówienie |
Gwarancja | 24 miesięcy |
Waga | 20 kg |
Cena zawiera wszystkie obowiązujące opłaty |
Szczegółowe informacje
OCP 3.0 Ready
GIGABYTE’s G-,H-,R- * series offer servers that feature an onboard OCP 3.0 slot for the next generation of PCIe 4.0 add on cards. Advantages of this new type include - Easier Serviceability: simply slot in / pull out the card without needing to open the server chassis; tool less design, and Larger Thermal Envelope: more space for heat sink provides an increased power budget for new & emerging capabilities
Hardware-level Root of Trust
Protection is built in the silicon to ensure systems will not be vulnerable to security attacks or cyber threats. This hardware-level root of trust (ROT) helps isolate the system as the boot process starts to make sure a verified code is used.
Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface (SPI) or low pin count (LPC) interface.
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
Cold Redundancy
To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, resulting in a 10% improvement in efficiency.
Smart Crises Management and Protection (SCMP)
SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.
Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.
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- Dimensions
Form Factor 2U WxHxD, mm 438 x 87.5 x 660 - Motherboard
Part number MZ32-AR0 - CPU
Model AMD EPYC™ 7003 Series processors Technology AMD 3D V-Cache™ Technology,
Single processor, 7nm technology, Up to 64-core, 128 threads per processorTDP 280W - Socket and Chipset
Chipset System on Chip - Memory
Slots 16 x DIMM DDR4 Memory architecture 8-Channel RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported Memory speed Up to 3200*/2933 MHz - LAN
Rear side 2 x 1GbE LAN ports (1 x Intel® I350-AM2) Support NCSI function Yes Management LAN 1 x 10/100/1000 - Storage
Front side 24 x 2.5" Gen3 NVMe hot-swappable bays Rear side 2 x 2.5" SATA/SAS hot-swappable bays RAID N/A
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- Expansion Slots
Total 1 x PCIe Gen4 low-profile slot Slot_6: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
Slot_5: 1 x PCIe x16 (Gen4 x8) slot
Slot_4: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
Slot_3: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
Slot_2: 1 x PCIe x8 (Gen3 x0 or x8) slot, disabled
Slot_1: 1 x PCIe x16 (Gen3 x16 or x8) slot, occupied by CNV3024, 4 x NVMe HBAOCP 2.0 mezzanine slot 1x with PCIe Gen3 x16, occupied by CNVO124, 4 x NVMe HBA M.2 slots - 2x M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280 cards- Backplane Board
Front side - CBP20O5 PCIe Gen3 x4 Rear side - CBP2021 SATA 6Gb/s or SAS 12Gb/s - TPM
TPM header SPI interface Optional TPM2.0 kit CTM010 - Power Supply
Certification 80 PLUS Platinum redundant Power 1200W QTY 1+1 - Fans
System 4 x 80x80x38mm (16,300rpm) - Weight
Net Weight 17.78 kg Gross Weight 24.76 kg - Video
Integrated Aspeed® AST2500 PCIe bus interface 2D Video Graphic Adapter Resolution 1920x1200@60Hz 32bpp
Parametry
Rozmiar U | 2 |
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Głębokość w mm | 660 |
Producent procesora | AMD |
Socket | SP3 |
Liczba dysków twardych | 26 |
Ilość slotów dyskowych 2.5" | 26 |
Ilość slotów dyskowych 3.5" | 0 |
Ilość slotów NVMe | 24 |
Całkowita liczba PCIe | 3 |
OCP/AIOM | 1 |
Moc (W) | 1300 |
Certyfikacja efektowności | Titanium |