3rd Gen Intel® Xeon® Scalable Processors – “Ice Lake”
GIGABYTE servers and Intel Xeon Scalable Processors deliver incredible 1P/2P performance from edge to data center with incredible gains in I/O throughput and workload demands that need high performing CPUs with large, yet optimized, memory configurations.
Rozwiązania serwerowe
Zestawy GIGABYTE
Rackmounts
Max I/O Systems
Network Server
GIGABYTE R282-3C2 (rev. 100) - 6NR2823C2MR-00-1T
GIGABYTE R282-3C2 (rev. 100) - 6NR2823C2MR-00-1T
3rd Gen Intel® Xeon® Scalable Processors Dual processor, LGA 4189 8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs Supports Intel® Optane™ Persistent Memory 200 series Dual ROM Architecture Supports GRAID SupremeRAID NVMe/NVMe-oF RAID Card Intel® C621A Chipset 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays 8 x 3.5"/2.5" SATA/SAS hot-swappable bays 2 x 2.5" SATA/SAS hot-swappable bays on rear side 6 x FHHL PCIe Gen4 x16 and x8 slots 2 x LP PCIe Gen4 x8 slots 1 x OCP 3.0 Gen4 x16 slot 1 x OCP 2.0 Gen3 x8 mezzanine slot 1+1 1600W (240V) 80 PLUS Titanium redundant power supplies
Oferujemy także sześć miesięcy darmowego housingu w naszym centrum danych TIER III.
Komponenty to nie koniec — zapytaj nas o niestandardową konfigurację serwera. Zaplanujemy serwer, złożymy go, fachowo skonfigurujemy i udostępnimy gwarancję rozszerzoną lub NBD.
| Kod towaru | 202.166088 |
|---|---|
| Part number | 6NR2823C2MR-00-1T |
| Producent | GIGABYTE |
| Dostępność | Na zamówienie |
| Gwarancja | 24 miesięcy |
| Waga | 20 kg |
| Cena zawiera wszystkie obowiązujące opłaty | |
Szczegółowe informacje
Enhanced I/0
Support for PCIe 4.0 allows for double the throughput of PCIe 3.0 for fast and large data transfers. Also, 64 lanes per socket with up to 128 lanes in a 2P configuration for fast data transmission from CPU to GPU, accelerator or storage.
CPU Performance Boost
Now up to 40 cores per socket with greatly improved IPC on Intel’s 10nm architecture while operating CPUs at 105-270W. Also, an additional UPI lane is added for up to 11.2GT/s for a low latency interconnect between CPUs.
Next Gen Memory
Each processor provides eight memory channels to support 8 or 16 DIMM slots with up to DDR4-3200. There are two sub-clustering modes, Sub NUMA (SNC) and Hemisphere (HEMI), available using balanced memory that results in performance improvements. Additionally, support for Intel Optane PMem 200 series provides two modes for greater memory capacity and data persistence to process large amounts of data faster.
Next Level Security
New instructions and architecture deliver a high level of cryptographic operations for data privacy and protection. Cryptographic accelerators speed up encryption protocols as well as improvements in software guard extensions and memory encryption are added.
AI Acceleration
AI inference and training are enhanced with DL Boost Technology for greater business, operational, and security insights. Applications include HPC, AI, and Media & Graphics.
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- Dimensions
Form Factor 2U WxHxD, mm 438 x 87.5 x 730 - Motherboard
Part number MR92-FS1 - CPU
Model 3rd Generation Intel® Xeon® Scalable Processors Technology Dual processor, 10nm technology TDP up to 270W - Socket and Chipset
Socket 2 x LGA 4189, Socket P+ Chipset Intel® C621A Chipset - Memory
Slots 32 x DIMM Memory architecture 8-channel RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported 1.2V modules 3200/2933/2666 MHz - LAN
Rear side 2 x 1Gb/s LAN ports (Intel® I350-AM2) Support NCSI function Yes Management LAN 1 x 10/100/1000 Mbps - Video
Integrated Aspeed® AST2600 PCIe bus interface 2D Video Graphic Adapter with PCIe bus interface Resolution 1920x1200@60Hz 32bpp, DDR4 SDRAM
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- Storage
Front side - 4 x 3.5"/2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 8 x 3.5"/2.5" SATA/SAS hot-swappable baysRear side: 2 x 2.5" SATA/SAS hot-swappable bays on rear side SAS card required for SAS devices support - Expansion Slots
Riser Card CRS2033 - 1 x PCIe x16 (Gen4 x16) FHHL slot, from CPU_0
- 2 x PCIe x8 (Gen4 x8) FHHL slots, from CPU_0Riser Card CRS2137 - 1 x PCIe x16 (Gen4 x16 or x8) FHHL slot, from CPU_1
- 1 x PCIe x8 (Gen4 x0 or x8) FHHL slot, from CPU_1
- 1 x PCIe x16 (Gen4 x16 or x8) FHHL slot, from CPU_1, shared with OCP 2.0Riser Card CRS2027 - 2 x PCIe x8 (Gen4 x8) low-profile slots, from CPU_1 - Backplane Board
Front side - CBP20C5 PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s Rear side - CBP2022 SATA 6Gb/s - TPM
TPM header SPI interface Optional TPM2.0 kit CTM010 - Power Supply
Certification 80 PLUS Titanium redundant Power 1600W QTY 1+1 - Fans
System 4 x 80x80x38mm (16,300rpm) - Packaging
Dimensions 982 x 588 x 268 mm
Parametry
| Całkowita liczba PCIe | 8 |
|---|---|
| Producent procesora | Intel |
| OCP/AIOM | 1 |
| Głębokość w mm | 730 |
| Ilość slotów dyskowych 2.5" | 2 |
| Ilość slotów dyskowych 3.5" | 12 |
| Liczba dysków twardych | 14 |
| Ilość slotów NVMe | 4 |
| Socket | 4189 |
| Certyfikacja efektowności | Titanium |
| Rozmiar U | 2 |
| Moc (W) | 1600 |
