Supermicro SYS-210GT-HNC8F
Single-Socket, skalowalne procesory Intel® Xeon® 3. generacji o TDP do 270 W, Intel® C621A, do 16 gniazd DIMM lub 4 TB (z obsługą pamięci trwałej Intel® Optane™), opcjonalnie: AIOM PCI-E 4.0 x16 LP (zgodność z OCP 3.0)
Oferujemy także sześć miesięcy darmowego housingu w naszym centrum danych TIER III.
Komponenty to nie koniec — zapytaj nas o niestandardową konfigurację serwera. Zaplanujemy serwer, złożymy go, fachowo skonfigurujemy i udostępnimy gwarancję rozszerzoną lub NBD.
| Kod towaru | 202.161244 |
|---|---|
| Part number | SYS-210GT-HNC8F |
| EAN | 4067488022869 |
| Producent | Supermicro |
| Dostępność | Na zamówienie |
| Gwarancja | 24 miesięcy |
| Waga | 39.9 kg |
| Cena zawiera wszystkie obowiązujące opłaty | |
Szczegółowe informacje
Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 1 CPU, 1 DIMM, 1 GrandTwin I/O Module and 1 storage device per node (HDD/SSD/NVMe/M.2)
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| Motherboard | |
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Super X12SPT-GC |
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| Cores |
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| System Memory (per Node) | |
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| Memory |
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| On-Board Devices (per Node) | |
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| SAS |
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| Chipset |
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| Network Connectivity |
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| IPMI |
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| Input / Output (per Node) | |
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| LAN |
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| USB |
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| Video |
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| Others |
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| System BIOS | |
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| PC Health Monitoring | |
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| CPU |
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Titanium Level |
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| Parts List - (Items Included) | |||
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Part Number |
Qty |
Description |
| Motherboard / Chassis | MBD-X12SPT-GC |
4 |
Super X12SPT-GC Motherboard |
| Cable 1 | CBL-PWCD-0578-1 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG,RoHS |
| Software | SFT-OOB-LIC | 4 | License key for enabling OOB BIOS management |
| Heatsink / Retention | SNK-P0077V | 4 | X12 ICX/CPX CPU Heatsink (78x113x25.5mm), VC Base, Cu Fin |
| *Power Supply | PWS-2K21A-BR | 2 | 2200W MicroBlade redundant Power Supply, Titanium Level |
| *Power Distributor | BPN-PDB-GT214 | 1 | Power Distribution for GrandTwin |
| *FAN 1 | FAN-0183L4 | 2 | 80x80x38 mm, 16.5K RPM, Non-hot-swappable Middle Cooling Fan for X11 Twin Pro, X10 and X11 Big Twin Series Servers |
| *Rail Set | MCP-290-00172-0N | 1 | 2U non-tip rail set, quick release, default for 2,3U 17.6";W |
Notes:
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| Optional Parts List | |||
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| Part Number | Qty | Description | |
| AIOM Enablement Kit | MCP-450-21403-ASM | 0 - 1 | GT214 AIOM kit,RoHS |
| GrandTwin I/O Module 2x10GbE | AOC-GTG-I2T-O | 1 | Grand Twin I/O card 2-Port 10GbE RJ45, Intel Carlsville X710-AT2, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 & 1x VGA port.,RoHS |
| GrandTwin I/O Module 2x25GbE | AOC-G25G-M2S-O | 1 | Grand Twin I/O card 2-Port 25GbE SFP28, Mellanox CX-4 Lx EN, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 & 1x VGA port.,RoHS |
| HDD Dummy Tray | MCP-120-21401-0N | 0 - 2 | GT214 FIO HDD dummy bracket(1slot) |
| NVMe Enablement Kit | MCP-450-21402-ASM | 0 - 2 | GT214 2 port NVMe U.2 Kit,RoHS |
| SAS/SATA Enablement Kit | MCP-450-21404-ASM | 0 - 1 | GT214 2 Port SATA/SAS U.2 kit,RoHS |
| SPI Capable TPM 1.2 | AOM-TPM-9671H-S | - | SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor |
| SPI Capable TPM 2.0 | AOM-TPM-9670H-S | - | SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor |
| SPI Capable TPM 2.0 with FIPS 140-2 | AOM-TPM-9670H-FIPS | - | SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor, Supporting FIPS 140-2 |
| VROC Intel SSD Only | AOC-VROCINTMOD | - | Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only) |
| VROC Premium | AOC-VROCPREMOD | - | Intel VROC Premium, RAID 0, 1, 5, 10 |
| VROC Standard | AOC-VROCSTNMOD | - | Intel VROC Standard, RAID 0, 1, 10 |
Parametry
| Całkowita liczba PCIe | 3 |
|---|---|
| OCP/AIOM | 0 |
| Głębokość w mm | 711.2 |
| Ilość slotów dyskowych 2.5" | 4 |
| Ilość slotów dyskowych 3.5" | 0 |
| Liczba dysków twardych | 4 |
| Ilość slotów NVMe | 4 |
| Certyfikacja efektowności | Titanium |
| Rozmiar U | 2 |
| Moc (W) | 2200 |
