Supermicro SYS-211GT-HNTR
Skalowalne procesory Intel® Xeon® 4. generacji Single-Socket do 300 W TDP Intel® C741 16 gniazd DIMM do 4 TB (z obsługą pamięci trwałej Intel® Optane™) 2 AIOM Zintegrowany moduł I/O GrandTwin z BMC, 2x USB, VGA i 2x 10GbE lub 2x 25GbE
Oferujemy także sześć miesięcy darmowego housingu w naszym centrum danych TIER III.
Komponenty to nie koniec — zapytaj nas o niestandardową konfigurację serwera. Zaplanujemy serwer, złożymy go, fachowo skonfigurujemy i udostępnimy gwarancję rozszerzoną lub NBD.
| Kod towaru | 202.169108 |
|---|---|
| Part number | SYS-211GT-HNTR |
| EAN | 4067488238604 |
| Producent | Supermicro |
| Dostępność | Na zamówienie |
| Gwarancja | 24 miesięcy |
| Waga | 39.9 kg |
| Cena zawiera wszystkie obowiązujące opłaty | |
Szczegółowe informacje
Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 1 CPU, 1 DIMM, 1 GrandTwin I/O Module and 1 storage device per node (HDD/SSD/NVMe/M.2)
| Motherboard | |
| Super X13SET-G |
| Processor (per Node) | |
| CPU |
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| Note |
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| System Memory (per Node) | |
| Memory |
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| On-Board Devices (per Node) | |
| Chipset |
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| Network Connectivity |
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| IPMI |
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| Input / Output (per Node) | |
| LAN |
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| USB |
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| Video |
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| System BIOS | |
| BIOS Type |
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| Management | |
| Software |
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| Power Configurations |
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| PC Health Monitoring | |
| CPU |
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| FAN |
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| Temperature |
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| Chassis | |
| Form Factor |
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| Model |
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| Dimensions and Weight | |
| Height |
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| Width |
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| Depth |
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| Package |
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| Weight |
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| Available Color |
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| Front Panel | |
| Buttons |
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| LEDs |
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| Expansion Slots (per Node) | |
| PCI-Express (PCIe) |
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| Drive Bays / Storage (per Node) | |
| Hot-swap |
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| M.2 |
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| System Cooling | |
| Fans |
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| Power Supply | |
| Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus | |
| Dimension (W x H x L) |
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| AC Input |
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| Certification |   Titanium Level[ Test Report ] |
| Operating Environment | ||
| RoHS |
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| Environmental Spec. |
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| Standard Parts (Parts Included) | |||
| Part Number | Qty | Description | |
| Motherboard / Chassis | MBD-X13SET-G |
4 |
Super X13SET-G Motherboard |
| Backplane | BPN-NVME5-F418-B6S6 | 4 | 1U 6-Slot X13 FatTwin 2.5 |
| Cable | CBL-MCIO-1218M5-1 | 12 | MCIO x8 (STR to STR),18CM,85OHM,RoHS |
| CBL-PWCD-0578-1 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG,RoHS | |
| CBL-PWEX-1131-20 | 4 | MicroHi (2x2 to 2x2), PH3.0, 20cm, 9.5A/p, 18AWG, RoHS | |
| CBL-SAST-1213QL4-100 | 8 | [NR]SlimSASLP x4 to SlimSAS x4,13cm,100OHM,RoHS | |
| Software | SFT-OOB-LIC | 4 | License key for enabling OOB BIOS management |
| Heatsink / Retention | SNK-P0087V | 4 | 1U Passive CPU VC HS for X13 Intel Eagle Stream Platform |
| *Power Supply | PWS-2K21A-BR | 2 | 2200W MicroBlade redundant Power Supply, Titanium Level |
| *Power Distributor | BPN-PDB-GT214 | 1 | Power Distribution for GrandTwin |
| *Rail Set | MCP-290-00172-0N | 1 | 2U non-tip rail set, quick release, default for 2,3U 17.6";W |
 Notes:
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| Optional Parts List | |||
| Part Number | Qty | Description | |
| AIOM Enablement Kit | MCP-450-21403-ASM | 0 - 1 | GT214 AIOM kit,RoHS |
| GrandTwin I/O Module 2x10GbE | AOC-GTG-I2T-O | 1 | Grand Twin I/O card 2-Port 10GbE RJ45, Intel Carlsville X710-AT2, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 & 1x VGA port.,RoHS |
| AOC-GTG-B2T-O | 1 | Grand Twin I/O card 2-Port 10GbE RJ45, Broadcom BCM57416, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 & 1x VGA port.,RoHS | |
| GrandTwin I/O Module 2x25GbE | AOC-G25G-M2S-O | 1 | Grand Twin I/O card 2-Port 25GbE SFP28, Mellanox CX-4 Lx EN, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 & 1x VGA port.,RoHS |
| HDD Dummy Tray | MCP-120-21401-0N | 0 - 2 | GT214 FIO HDD dummy bracket(1slot) |
| NVMe Enablement Kit | MCP-450-21402-ASM | 0 - 2 | GT214 2 port NVMe U.2 Enablement Kit, RoHS |
| SAS/SATA Enablement Kit | MCP-450-21404-ASM | 0 - 1 | GT214 4 Port SATA/SAS U.2 Enablement kit, RoHS |
| MCP-450-21405-ASM | 0 - 1 | GT214 2 Port SATA/SAS U.2 Enablement kit, RoHS | |
| SPI Capable TPM 1.2 | AOM-TPM-9670V-S | - | SPI Capable TPM 1.2 Provisioned for Server, Horizontal Form Factor |
| SPI Capable TPM 2.0 | AOM-TPM-9670V-S | - | SPI Capable TPM 2.0 Provisioned for Server, Horizontal Form Factor |
Parametry
| Rozmiar U | 2 |
|---|---|
| Głębokość w mm | 711.2 |
| Producent procesora | Intel |
| Socket | 4677 |
| Liczba dysków twardych | 24 |
| Ilość slotów dyskowych 2.5" | 24 |
| Ilość slotów dyskowych 3.5" | 0 |
| Ilość slotów NVMe | 6 |
| Całkowita liczba PCIe | 8 |
| OCP/AIOM | 0 |
| Moc (W) | 2200 |
| Certyfikacja efektowności | Titanium |
